MULTILAYER-CIRCUIT-BOARD MANUFACTURING METHOD AND MULTILAYER CIRCUIT BOARD

摘要

This multilayer-circuit-board manufacturing method includes the following steps: a core-circuit-board formation step in which a patterned first conductive layer is formed on at least one surface of a flat core substrate, yielding a core circuit board; a layering step in which insulating substrates each comprising an insulating material are provided on both sides of the core circuit board and metal films are provided on the outsides of said insulating substrates; a pressing step in which vacuum pressure is used to press the core circuit board, the insulating substrates, and the metal films against each other; and a pattern formation step in which the metal films are patterned so as to form second conductive layers. In the pressing step, the core circuit board is warped at a plurality of points so as to give said core circuit board an undulating cross-section.