发明名称 MOUNTING STRUCTURE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure of multilayer ceramic electronic component capable of reducing noise without dividing an electrode land.SOLUTION: A mounting structure 1 of a multilayer ceramic electronic component according to the present invention includes: a multilayer ceramic electronic component 2 having a ceramic element 3, first and second internal electrodes 4a, 4b formed so as to have opposing portions 4a1, 4b1 which are at least a part of the internal electrodes 4a, 4b and opposed to each other in a thickness direction in the ceramic element 3, a first terminal electrode 5a electrically connected to the first internal electrode 4a, and a second terminal electrode 5b electrically connected to the second internal electrode 4b; and a circuit board 6 having first and second electrode lands 7a, 7b electrically connected to the first and second terminal electrodes 5a, 5b and on which the multilayer ceramic electronic component 2 is mounted. A width between the first and second electrode lands 7a, 7b is smaller than a width between the first and second internal electrodes 4a, 4b in the above opposing portions 4a1, 4b1.
申请公布号 JP2015228482(A) 申请公布日期 2015.12.17
申请号 JP20150036267 申请日期 2015.02.26
申请人 MURATA MFG CO LTD 发明人 TAKEUCHI SHUNSUKE;NISHIMURA MASASHI
分类号 H01G2/06;H01G4/232;H01G4/30;H05K3/34 主分类号 H01G2/06
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