SEMICONDUCTOR DEVICE WITH COVERING MEMBER THAT PARTIALLY COVERS WIRING SUBSTRATE

摘要

An error is prevented from being generated at a mounting position of an electronic component on a wiring substrate. A first semiconductor chip has a main surface and a rear surface. The rear surface is an opposite surface of the main surface. The rear surface of the first semiconductor chip is an opposite surface of the main surface thereof. A wiring substrate is rectangular, and has a main surface and a rear surface. The first semiconductor chip is mounted on the main surface of the wiring substrate. A lid covers the main surface of the wiring substrate, and the first semiconductor chip. An electronic component is mounted on the rear surface of the wiring substrate. The main surface of the wiring substrate has uncovered regions that are not covered with the lid at at least two corners facing each other.

主权项

1. A semiconductor device, comprising:
a substrate including a semiconductor chip; a covering member that covers a first surface of the substrate and the semiconductor chip, the covering member including a first portion, a second portion and an third portion, the third portion is mounted to the substrate and the second portion connects the first portion to the third portion; and an electronic component that is mounted on a second surface of the substrate, wherein the first surface of the substrate includes a region that is not covered by the covering member.