发明名称 |
TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS |
摘要 |
A package includes a semiconductor chip. The semiconductor chip includes a test pad, and a plurality of microbump pads, wherein each microbump pad of the plurality of microbump pads is electrically connected to the test pad. The package further includes a substrate; and a plurality of microbumps configured to electrically connect the semiconductor chip to the substrate, wherein each microbump of the plurality of microbumps is electrically connected to a corresponding microbump pad of the plurality of microbump pads. The package further includes a package substrate, wherein the package substrate comprises a bump pad, wherein an area of the bump pad is greater than a combined area of the test pad and the plurality of microbump pads. The package further includes a bump configured to electrically connect the substrate to the package substrate. |
申请公布号 |
US2015362526(A1) |
申请公布日期 |
2015.12.17 |
申请号 |
US201514833950 |
申请日期 |
2015.08.24 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WU Wei-Cheng;HU Hsien-Pin;HOU Shang-Yun;JENG Shin-Puu;YU Chen-Hua;YANG Chao-Hsiang |
分类号 |
G01R1/04;G01R31/28;G01R31/26 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
1. A package comprising:
a semiconductor chip, wherein the semiconductor chip comprises:
a test pad, anda plurality of microbump pads, wherein each microbump pad of the plurality of microbump pads is electrically connected to the test pad; a substrate; a plurality of microbumps configured to electrically connect the semiconductor chip to the substrate, wherein each microbump of the plurality of microbumps is electrically connected to a corresponding microbump pad of the plurality of microbump pads; a package substrate, wherein the package substrate comprises a bump pad, wherein an area of the bump pad is greater than a combined area of the test pad and the plurality of microbump pads; and a bump configured to electrically connect the substrate to the package substrate. |
地址 |
Hsinchu TW |