RESIN COMPOSITION AND ELECTRIC DEVICE

摘要

The present invention addresses the problem of providing an excellent heat-curable resin which has a reduced viscosity and is improved in both heat resistance and toughness or mechanical strength required for improving cracking resistance which have had a trade-off relation to each other previously. The present invention also addresses the problem of providing an electronic or electric device in which a cured article produced using the heat-curable resin is used as an insulation material or a structural material. The present invention involves multiple types of means for solving the problems. One embodiment of the means is characterized by being a heat-curable resin composition which comprises: a three-dimensional copolymer produced by copolymerizing a maleimide derivative with a styrene derivative using an alkylborane or a boron compound as a polymerization initiator; and a heat-curable resin composition.