APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD, APPARATUS FOR MANUFACTURING WIRING BOARD, AND APPLYING DEVICE

摘要

According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

主权项

1. A method for manufacturing a flexible printed wiring board, the method comprising:
selectively providing a second conductor layer on a surface of a first conductor layer by selectively applying an electrically conductive paste onto the surface of the first conductor layer with use of screen printing or ink jet printing; selectively providing a first insulating layer on the surface of the first conductor layer by selectively applying an insulating resin onto the surface of the first conductor layer with use of screen printing or ink jet printing; integrating the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer by pressing and heating in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from the side opposite the first conductor layer and in which the first conductor layer and the third conductor layer are sandwiched between presses; forming a conductor pattern by selectively removing at least one of the first conductor layer and the third conductor layer in a structure obtained by integrating the first conductor layer, the second conductor layer, the first insulating layer, and the third conductor layer; and covering both sides of the structure in which the conductor pattern is formed with second insulating layers, wherein before the integrating the first conductor layer, the second conductor layer, the first insulating layer, and the third conductor layer, the height of the second conductor layer becomes higher than the height of the first insulating layer, and before the integrating the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, a gap is provided between the second conductor layer and the first insulating layer.