MODULE, MODULE COMPONENT COMPOSING THE MODULE, AND METHOD OF MANUFACTURING THE MODULE

摘要

To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.

主权项

1. A module comprising:
a first circuit board; a second circuit board arranged so as to face the first circuit board; and a functional component that includes a first electrode and a second electrode electrically connected to the first electrode on both opposing faces of the first circuit board and the second circuit board, the first electrode being connected to the first circuit board, the second electrode being connected to the second circuit board.