THERMOSETTING EPOXY RESIN COMPOSITION AND USES THEREOF

摘要

A thermosetting epoxy resin composition and uses thereof. The thermosetting epoxy resin composition contains by weight parts: 100 weight parts of epoxy resin, 1 to 10 weight parts of aromatic diamine, 0.5 to 2.2 weight parts of dicyandiamide, 30 to 200 weight parts of an inorganic filler containing boehmite or and barium sulfate, and 0.05 to 1.0 weight parts of a curing accelerator. The thermosetting epoxy resin composition has a CTI>600V, and can be used to fabricate a prepreg and a laminate for a printed circuit.