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发明名称
具特性匹配功能的半导体测试载具
摘要
本发明系关于一种具特性匹配功能的半导体测试载具,主要系于一载具本体上形成有一测试区,测试区底部设有一散热金属块,且沿着散热金属块周围设有多数的测试针,该散热金属块和一接地端电连接且具有多个侧边,该散热金属块的各个侧边分别邻近对应的测试针,而与各测试针构成的讯号传输路径构成阻抗匹配;当一积体电路置入测试区内且积体电路底部的接脚与各测试针构成电连接时,该测试载具利用趋近的散热金属块与讯号传输路径构成阻抗匹配,且提供一参考位准,以便将测试载具对讯号传输的损耗影响降至最低。
申请公布号
TW201546462
申请公布日期
2015.12.16
申请号
TW103119957
申请日期
2014.06.09
申请人
佳思科技有限公司
发明人
吴松茂;郑冠毅;黄荣书
分类号
G01R31/26(2014.01);G01R31/28(2006.01)
主分类号
G01R31/26(2014.01)
代理机构
代理人
桂齐恒林景郁
主权项
地址
高雄市苓雅区自强三路3号26楼之10 TW
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