| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simplify structure of a spring for fixing a semiconductor module. <P>SOLUTION: A semiconductor control device 1 has a spring member 6 which pressurizes a semiconductor module 4 to a cooling member 2. Since a pair of contact arm parts 11 are formed for each of three semiconductor modules 4 in the spring member 6, pressurization force to be generated by a fact that the arm parts 11 are deformed is uniformly affected for every semiconductor module 4. Since a center arm part 11A which is separated from a through hole 12 to be screwed is folded to a lower side than two other arm parts 11, floating of the arm part 11A is prevented. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
