发明名称 |
HIGH TEMPERATURE HEATING SYSTEM |
摘要 |
A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater. |
申请公布号 |
EP2786116(A4) |
申请公布日期 |
2015.12.16 |
申请号 |
EP20120853965 |
申请日期 |
2012.11.28 |
申请人 |
HYSITRON, INC. |
发明人 |
OH, YUNJE;ASIF, SYED AMANULLA SYED;CYRANKOWSKI, EDWARD;KERANEN, LUCAS PAUL;MAJOR, RYAN;MISIAK, MACIEJ W.;WARREN, ODEN LEE |
分类号 |
G01N3/54 |
主分类号 |
G01N3/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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