发明名称 HIGH TEMPERATURE HEATING SYSTEM
摘要 A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.
申请公布号 EP2786116(A4) 申请公布日期 2015.12.16
申请号 EP20120853965 申请日期 2012.11.28
申请人 HYSITRON, INC. 发明人 OH, YUNJE;ASIF, SYED AMANULLA SYED;CYRANKOWSKI, EDWARD;KERANEN, LUCAS PAUL;MAJOR, RYAN;MISIAK, MACIEJ W.;WARREN, ODEN LEE
分类号 G01N3/54 主分类号 G01N3/54
代理机构 代理人
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