发明名称 半導体発光装置のためのパッケージ
摘要 A packaged light emitting device includes a frame, a cover, and a light emitting device. The light emitting device is disposed between the cover and the frame. A portion of the cover is flexible and a portion of the cover is rigid. The cover includes a flange and is attached to the frame by positioning the rigid portion of the cover to maintain the flange in a nest formed in the frame. In some embodiments, a stake is disposed over the sunken surface that forms the nest in the frame, and the cover is held in place by positioning the flange between the sunken surface and the stake. In some embodiments, the flange is the same material as the flexible portion and the rigid portion is a ring that extends into the flange.
申请公布号 JP5833803(B2) 申请公布日期 2015.12.16
申请号 JP20050250246 申请日期 2005.08.03
申请人 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 发明人 ハワード シー エプスタイン
分类号 H01L33/52;H01L33/48 主分类号 H01L33/52
代理机构 代理人
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