发明名称 窒化物半導体素子及びウェーハ
摘要 PROBLEM TO BE SOLVED: To provide a nitride semiconductor element and a wafer, which have less cracks.SOLUTION: According to an embodiment, a nitride semiconductor element comprises: a laminate including a laminated intermediate layer which includes a GaN intermediate layer having a flat principal surface, a high Al composition layer of AlGaN(0<x1&le;1) provided on the GaN intermediate layer and a low Al composition layer of AlGaN(0<y1<1, y1<x1) provided on the high Al composition layer; and a functional layer provided on the laminate. An Al composition ratio of the low Al composition layer is not greater than a ratio of an absolute value of a difference between lattice spacing of a distortionless GaN and lattice spacing of the high Al composition layer to an absolute value of a difference between lattice spacing of the distortionless GaN and distortionless AlGaN(0<x1&le;1). The low Al composition layer has compressive strain. Lattice spacing of the high Al composition layer is larger than lattice spacing of the distortionless AlGaN.
申请公布号 JP5833202(B2) 申请公布日期 2015.12.16
申请号 JP20140171580 申请日期 2014.08.26
申请人 株式会社東芝 发明人 彦坂 年輝;原田 佳幸;吉田 学史;杉山 直治;布上 真也
分类号 H01L21/205;H01L21/20;H01L21/338;H01L29/778;H01L29/80;H01L29/812;H01L33/12;H01L33/32 主分类号 H01L21/205
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