发明名称 半導体素子及びその製造方法
摘要 <p>A semiconductor device includes first, second, and third conductive lines, each with a respective line portion formed over a substrate and extending in a first direction and with a respective branch portion extending from an end of the respective line portion in a direction different from the first direction. The branch portion of a middle conductive line is disposed between and shorter than the respective branch portions of the outer conductive lines such that contact pads may be formed integral with such branch portions of the conductive lines.</p>
申请公布号 JP5833353(B2) 申请公布日期 2015.12.16
申请号 JP20110143327 申请日期 2011.06.28
申请人 三星電子株式会社Samsung Electronics Co.,Ltd. 发明人 柳 璋鉉;李 鐘▲ミン▼;朴 泳雨;郭 東華;金 泰▲ヨン▼;韓 智勳;羅 宗勳;李 東植
分类号 H01L21/3205;H01L21/336;H01L21/76;H01L21/768;H01L21/8247;H01L27/10;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/3205
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