发明名称 AN LED PACKAGE AND A BACKLIGHT UNIT COMPRISING SAID LED PACKAGE
摘要 A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.
申请公布号 EP2312660(A4) 申请公布日期 2015.12.16
申请号 EP20090773762 申请日期 2009.07.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, GEUN-YOUNG;ONISHI, TOMOHISA;LEE, JUNG-HUN;KIM, YOUNG-TAEK;PARK, JONG-JIN;YUN, MI-JEONG;PARK, YOUNG-SAM;HAHM, HUN-JOO;KIM, HYUNG-SUK;HAN, SEONG-YEON;KIM, DO-HUN;KIM, DAE-YEON;KIM, DAE-HYUN;PARK, JUNG-KYU
分类号 H01L33/48;G02F1/13357;H01L33/62 主分类号 H01L33/48
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