Method for producing a circuit board system

摘要

Methods for producing a circuit board system and a circuit board arrangement are disclosed. The method for producing a circuit board system includes: providing a first circuit board comprising a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; applying a second solder over the top metallization layer; providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; soldering the number of electronic components and the shielding frame to the top metallization layer by melting the second solder and by subsequently cooling the second solder to below its solidification temperature; applying a thermal interface material over the top side of at least one of the electronic components; providing a housing cover comprising an electrically conductive surface; and attaching the housing cover to the first circuit board such that the contact springs electrically contact the housing cover and that the thermal interface material mechanically contacts the housing cover and at least one of the electronic components. The method for producing a circuit board arrangement further includes: providing a second circuit board comprising a top side, a bottom side and a top metallization layer arranged at the top side; and electrically and mechanically connecting the soldering pads to the top metallization layer of the second circuit board by soldering.