发明名称 CONNECTION STRUCTURE USING CONDUCTIVE PARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a connection structure in which there is no unnecessary short-circuit between electrodes and which can securely connects wiring boards in a simple connection step. SOLUTION: There is provided a connection structure using a conductive particle for connecting wiring boards by providing a conductive particle (122) between electrodes (115a, 115b) opposed to each other and applying a magnetic field. A metal particle (120) having a magnetic property covered with an adhesive layer (121) is used as the conductive particle (122). The particle is pressed and heated in a state in which a magnetic field is applied to a predetermined electrode portion. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009004420(A) 申请公布日期 2009.01.08
申请号 JP20070161126 申请日期 2007.06.19
申请人 YASKAWA ELECTRIC CORP 发明人 TAKENAKA KUNIHIRO
分类号 H05K3/32 主分类号 H05K3/32
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