| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card with little fluctuations in the height of a probe needle. SOLUTION: In the probe card 30, which is equipped with a probe needle 31 contacting electrically an input and output terminal 110 of an IC device built-in a tested semiconductor wafer 100; a first basal plate 32 mounted with a large number of probe needles 31; a second base plate 33 connected electrically to a test head 10; an interposer 34 interposed between the first basal plate 32 and the second base plate 33; and a sealing member 35, forming a first enclosed space 36 between the first base plate 32 and the second base plate 33, by decompressing the first enclosed space 36, the first base plate 32 is fixed to the second base plate 33 and then the first base plate 32 is electrically connected to the second base plate 33 via the interposer 34. COPYRIGHT: (C)2009,JPO&INPIT
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