| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging body of a semiconductive endless rubber belt having a releasing layer on its surface capable of preventing any folding habit or rubbing damage in the semiconductive endless rubber belt from being generated, preventing any cracks from being generated in the releasing layer, simplifying the packaging, and reducing the volume of the packaging body. SOLUTION: In the packaging body of the semiconductive endless rubber belts, two semiconductive endless rubber belts are packaged as one packaging body; cylindrical bodies A and B are inserted in both ends on the inner side of one semiconductive endless rubber belt (a); cylindrical bodies C and D are inserted in both ends on the inner side of the other semiconductive endless rubber belt b; the rubber belt (a) is folded and the cylindrical body A and the cylindrical body B are brought into contact with each other via the rubber belts; the cylindrical body C is held in the folded rubber belt (a); the rubber belt b is folded and the cylindrical body C and the cylindrical body D are brought into contact with each other via the rubber belt; the cylindrical body B is held in the folded rubber belt b; and the releasing layer is provided on the surface on which the cylindrical bodies A, B, C, D and the semiconductive endless rubber belts (a) and b are fixed thereto. COPYRIGHT: (C)2009,JPO&INPIT
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