发明名称 |
PACKAGING DEVICE AND PACKAGING METHOD FOR ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging device for stamping out electronic components from a carrier tape accurately to be packaged on a board. <P>SOLUTION: This packaging device comprises: a drive sprocket 19 for feeding a carrier tape 1 drawn out from a supply reel 15; a takeup reel 26 for taking up the carrier tape in which the electronic components are stamped out by a mold assembly 28; a plurality of packaging heads provided at given intervals in a peripheral direction of an index table for packaging the electronic component on the board when the electronic component is delivered and positioned at a predetermined location by a rotation of the index table; a first image pick-up camera for picking up images of a positioning mark at one end located in a feed direction of the carrier tape of the electronic component held by the packaging heads and a cutting line of an end at the one end before the electronic component is packaged on the board; and a controller for calculating a distance from the positioning mark to the cutting line according to an image pick-up signal of the first image pick-up camera and for controlling a feed per revolution of the carrier tape by the drive sprocket in response to the distance. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009004652(A) |
申请公布日期 |
2009.01.08 |
申请号 |
JP20070165534 |
申请日期 |
2007.06.22 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
WARIGAI SENSUKE |
分类号 |
H01L21/60;H05K13/02;H05K13/08 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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