| 摘要 |
<p>In a laser processing apparatus, a subject to be processed is placed on a work supporting table, which supports the subject on a plurality of supporting points, and while moving a processing head in a direction horizontal to the subject, the subject on the supporting table is processed with laser by the processing head. The laser processing apparatus is provided with a tilt judging section (15) and a drive control section (17). The tilt judging section judges whether a product chip is tilted in the height direction and is protruded to the processing head side above the subject prior to laser processing, based on the positional relationship between the product chip, which is to be separated from the subject after the subject is laser-processed, and the supporting points. The drive control section controls the height of the processing head for the subject, based on the judgment result obtained from the tilt judging section (15), at the time of moving the processing head to the subsequent product chip processing position after the product chip laser processing is completed.</p> |
