| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin package that comprises a thermosetting resin as a base and has a high dimensional accuracy, a low warpage, a low thermal expansion and high heat resistance. SOLUTION: The molding resin composition comprises (A) a polyfunctional epoxy resin prepared by glycidylating a condensate of a salicylaldehyde and a phenol, (B) a phenol resin curing agent, (C) a curing promoter and (D) silica powder having a weight-average particle diameter of 10-30μm as essential components in which the ratio of (D) the silica powder in the total resin composition is 80-90 mass% and the ratio of fused silica powder in (D) the silica powder is 80-100 mass%. The resin package is constituted by using the molding resin composition. COPYRIGHT: (C)2009,JPO&INPIT
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