发明名称 |
Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |
摘要 |
The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
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申请公布号 |
US2009008141(A1) |
申请公布日期 |
2009.01.08 |
申请号 |
US20080230564 |
申请日期 |
2008.09.02 |
申请人 |
NAKAMURA HIDEHIRO;NAKASO AKISHI;ARIKE SHIGEHARU;INOUE FUMIO;ENOMOTO TETSUYA;MORIIKE NORIO;HIROKI KOUSUKE |
发明人 |
NAKAMURA HIDEHIRO;NAKASO AKISHI;ARIKE SHIGEHARU;INOUE FUMIO;ENOMOTO TETSUYA;MORIIKE NORIO;HIROKI KOUSUKE |
分类号 |
H05K1/11;H01L23/498;H05K1/16;H05K3/40;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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