发明名称 |
THREE-DIMENSIONAL PRINTED CIRCUIT BOARD, AND ITS MANUFACTURING METHOD |
摘要 |
A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure. |
申请公布号 |
EP2157838(A1) |
申请公布日期 |
2010.02.24 |
申请号 |
EP20080763923 |
申请日期 |
2008.05.28 |
申请人 |
PANASONIC CORPORATION |
发明人 |
NAKAMURA, TADASHI;ECHIGO, FUNIO;FUKASAWA, KOTA;HIRAI, SHOGO;KITA, TAKAYUKI |
分类号 |
H05K1/11;H05K1/14 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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