| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device reducing man-hours by substantially simultaneously performing a process for curing under-fill resin and a process for adhering and fixing a radiating plate. SOLUTION: The rear face 1a of a semiconductor element 1 is adhered to the radiating plate 5. The liquid or tape-like under-fill resin 4 is applied or arranged on the mounting face 3a of a wiring board 3. The projection electrode formation face of the semiconductor device 1 sandwiches the under-fill resin 4 to be opposed to the wiring board 3, and the radiating plate 5 is arranged on the wiring board 3 so that the radiating plate 5 sandwiches the under-fill resin 4 to be opposed to the wiring board 3. The semiconductor device 1 is mounted by a flip chip on the wiring board 3, the under-fill resin 4 is cured, and the radiating plate 5 and the semiconductor device 1 are adhered to the wiring board 3. |
