| 摘要 |
<p>Disclosed is a novel flame-retardant epoxy resin having high heat resistance and high reactivity, which is suitable for a copper-clad laminate used for electronic circuit boards, or for a sealing material, molding material, casting material, adhesive and insulating material used for electronic components. Also disclosed are an epoxy resin composition essentially containing such an epoxy resin, and a cured product of such an epoxy resin composition.Specifically disclosed is a novel flame-retardant epoxy resin represented by a specific general formula and containing nitrogen and phosphorus. Also specifically disclosed are a novel flame-retardant epoxy resin composition essentially containing the flame-retardant epoxy resin, and a cured product of a novel flame-retardant epoxy resin composition, which is obtained by heating and curing the novel flame-retardant epoxy resin composition.</p> |
