Circuit substrate and light emitting diode package

摘要

A circuit substrate including a base layer (F) and a plurality of lead units (300) arranged as an array is provided, wherein the base layer has a plurality of through grooves (F1), and the lead units are disposed on the base layer. Each of the lead units includes a common terminal (310) and at least three leads (320). The common terminal (310) is capable of being divided into a plurality of electrodes (E) connected with each other. The leads (320) are extended outwards from the edge of the common terminal (310), and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals (310) of the lead units.