| 摘要 |
To provide a method and an arrangement for heat treatment of substrates which allow continuously adjustable cooling rates over a wide temperature range with simultaneously largely homogeneous temperature distribution over the area of the heating/cooling plate, a cooling/heating plate is provided containing a multiplicity of cooling/heating pipes running parallel to one another. Each cooling/heating pipe comprises an outer pipe, an inner pipe which can carry a flow, and an interspace between them which can carry a flow. Each inner pipe is connected to a supply line for water and each interspace is connected to a supply line for air, with water and air being routed simultaneously though the cooling/heating plate. |
