| 摘要 |
A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent. [Formula 1] R1nSiR2(4-n) (I-1) (Wherein, n denotes a number of 0 to 2; R1 represent a hydrogen atom, or substituted or unsubstituted hydrocarbon groups having 1 to 18 carbon atoms; R2 represent a halogen atom, a hydroxyl group, substituted or unsubstituted oxy groups, amino groups, and carbonyloxy groups having 1 to 18 carbon atoms; and two or more of R1 and R2 may bind to each other to form a cyclic structure). |
