发明名称
摘要 <p>An apparatus for manufacturing electronic devices includes a laser device (101) for generating laser beams (101a), a masking unit (102) having a masking substrate for shaping beam spots of the laser beams, a first stage (300) for placing a first substrate (301), which carries a object to be transferred, a second stage (200) for placing a second substrate (201), to which the object to be transferred is transferred, an adhesive agent applying unit (500) for applying an adhesive agent on the object to be transferred or on a transferred position on the second substrate, and a control unit (700) for controlling the actions of the first and the second stages, and is characterized in that the control unit (700) transfers the object to be transferred from the first substrate to the second substrate by the steps of moving at least one of the first and the second stages for performing inter-substrate alignment of the masking substrate, the first and the second substrates, adhering the first and the second substrates, irradiating a laser beam onto the object to be transferred, and moving the first and the second substrates away from each other. <IMAGE></p>
申请公布号 JP4411575(B2) 申请公布日期 2010.02.10
申请号 JP20020124866 申请日期 2002.04.25
申请人 发明人
分类号 G02F1/13;H01L21/02;B23K26/02;B23K26/06;B23K26/067;B23K101/36;G02F1/1368;G09F9/00;H01L21/98;H01L27/12;H01L51/00;H01L51/40;H01L51/50;H05B33/10 主分类号 G02F1/13
代理机构 代理人
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