| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A photosensitive adhesive composition comprising (A) an alkali-soluble polymer, (B) a thermosetting resin, (C) one or more radiation-polymerizable compounds and (D) a photoinitiator, wherein the 5% weight reduction temperature of the mixture of all of the radiation-polymerizable compounds in the composition is 200°C or higher.</p> |
| 申请公布号 |
EP2151715(A1) |
申请公布日期 |
2010.02.10 |
| 申请号 |
EP20080752247 |
申请日期 |
2008.04.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MITSUKURA, KAZUYUKI;KAWAMORI, TAKASHI;MASUKO, TAKASHI;KATOGI, SHIGEKI |
| 分类号 |
G03F7/027;C08G73/10;C09J4/02;C09J7/02;C09J163/00;C09J179/08;G03F7/004;G03F7/037;H01L21/027 |
主分类号 |
G03F7/027 |
| 代理机构 |
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