ELECTROLYTIC COPPER FOIL, SURFACE TREATED ELECTROLYTIC COPPER FOIL USING SAID ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD USING SAID SURFACE TREATED ELECTROLYTIC COPPER FOIL

摘要

It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super lowprofile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.