| 摘要 |
The present invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a base (1) and a die-bonding film (3) provided on the pressure-sensitive adhesive layer (2), wherein the pressure-sensitive adhesive layer (2) is formed from an acrylic polymer comprising acrylic ester A represented by CH 2 =CHCOOR 1 (wherein R 1 is an alkyl group having 6 to 10 carbon atoms), acrylic ester B represented by CH 2 =CHCOOR 2 (wherein R 2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecule, the compounded ratio of the acrylic ester A and the acrylic ester B is 40 to 10 mol% of the acrylic ester B with respect to 60 to 90 mol% of the acrylic ester A, the compounded ratio of the hydroxyl group-containing monomer is in the range of 10 to 30 mol% with respect to 100 mol% of the total of the acrylic ester A and the acrylic ester B, the compounded ratio of the isocyanate compound is in the range of 70 to 90 mol% with respect to 100 mol% of the monomer containing a hydroxyl group, the pressure-sensitive adhesive layer (2) is cured by ultraviolet ray irradiation, and the die-bonding film (3) is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer (2) after the ultraviolet ray irradiation. |
