| 摘要 |
A dicing die-bonding film of the present invention has a dicing film having a pressure-sensitive adhesive layer (2) on a base (1) and a die-bonding film (3) provided on the pressure-sensitive adhesive layer (2), wherein the pressure-sensitive adhesive layer (2) is formed from an acrylic polymer comprising an acrylic ester A represented by CH 2 =CHCOOR 1 (wherein R 1 is an alkyl group having 6 to 10 carbon atoms), an acrylic ester B represented by CH 2 =CHCOOR 2 (wherein R 2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecule, the compounded ratio of the acrylic ester A and the acrylic ester B is 40 to 10 mol% of the acrylic ester B to 60 to 90 mol% of the acrylic ester A, the compounded ratio of the hydroxyl group-containing monomer is in a range of 10 to 30 mol% to 100 mol% of the total of the acrylic ester A and the acrylic ester B, the compounded ratio of the isocyanate compound is in a range of 70 to 90 mol% to 100 mol% of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin. |
