发明名称 WIRING BOARD WITH BUILT-IN COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board with a built-in component capable of unfailingly connecting the built-in component to a conductor layer and improving connection reliability, and to provide the wiring board with the built-in component. <P>SOLUTION: The manufacturing method is provided with: a protruding conductor forming step of forming a protruding conductor 51 by bonding a bonding portion in a metal member equipped with a wire and the bonding portion to external electrodes 121, 122 and then separating the wire; a housing step of housing a capacitor 101 into a housing hole 90 of a core substrate 11; a resin filling/sealing step of filling and sealing a gap in the housing hole 90 of the core substrate 11 in which the capacitor 101 is housed, with an insulative resin (being a resin filling portion 92). Preferably, after the resin filling/sealing step, the manufacturing method is provided with a height aligning step of aligning the height so that tops of a plurality of protruding conductors 51 and a core rear surface 13 of the core substrate 11 may be included in one planar surface. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010021368(A) 申请公布日期 2010.01.28
申请号 JP20080180661 申请日期 2008.07.10
申请人 NGK SPARK PLUG CO LTD 发明人 OTSUKA ATSUSHI;SATO MANABU;SATO MOTOHIKO;HIRANO SATOSHI;OKUYAMA MASAHIKO
分类号 H05K3/46 主分类号 H05K3/46
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