| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid-state imaging device which reduces a reattachment of a contaminant onto a solid-state imaging element. <P>SOLUTION: This solid-state imaging device includes the solid-state imaging element which includes: a first side face wall and a second side face wall separate from each other; a first end face wall between a first end of the first side face wall and a first end of the second side face wall; a second end face wall between a second end of the first side face wall and a second end of the second side face wall; and a base part connecting these bases, wherein a recess part surrounded by the first side face wall, the second side face wall, the first end face wall, the second end face wall and the base part is formed and disposed on the base part. A distance (first distance) between a face on the recess part side of the first side face wall and a face vertical to the base part and parallel to a longitudinal direction and a distance (second distance) between a face on the recess part side of the second side face wall and the face vertical to the base part and parallel to the longitudinal direction change depending upon a position of the longitudinal direction, and in a washing process in which a fluid is sprayed on the solid-state imaging element by a nozzle, the nozzle is scanned toward a direction of prolonging the first and second distance. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
