| 摘要 |
PROBLEM TO BE SOLVED: To prevent a lead-free solder from being cracked even when the lead-free solder is used by reducing a mechanical stress due to temperature changes in a ground terminal, a circuit board and the lead-free solder. SOLUTION: A curved portion 110A which is part of a ground terminal 105A extended from one portion of a tuner case 101 is successively pressed to form a width smaller than the width of the ground terminal in the vicinity of a solder junction portion 108; or coining processing is performed to form a plate thickness smaller than the plate thickness of the ground terminal in the vicinity of the solder junction portion 108. Consequently, stress caused by differences in thermal expansion coefficients among the ground terminal 105A, the circuit board 102 and the lead-free solder can be absorbed during the driving of a tuner apparatus, and the lead-free solder can be prevented from being cracked. COPYRIGHT: (C)2010,JPO&INPIT
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