| 摘要 |
PURPOSE: A supply apparatus, a semiconductor manufacturing apparatus and a semiconductor manufacturing method are provided to form a uniform thickness of cap metal on a wafer by preventing affects of byproducts produced in plating. CONSTITUTION: A supply apparatus comprises nozzles(144a,144b,144c,154), a temperature controller, an insulation part, and a delivery mechanism. The nozzles have supply holes for discharging plating liquid to the target surface of a wafer. The temperature controller accepts plating liquid for processing a certain amount of wafers, and controls the temperature of the plating liquid. The insulation part keeps the temperature of the plating liquid. The delivery device transfers the temperature-controlled plating liquid to the supply holes of the nozzles after the insulation part. |
