发明名称 |
HEAT SPREADER FOR PRINTED CIRCUIT BOARDS |
摘要 |
A laminate comprising at least one layer of graphite and at least one layer of a dielectric material, wherein the graphite has an in-plane thermal conductivity of at least about 300 W/m° K, suitable for uses such as printed circuit boards. |
申请公布号 |
EP1848558(A4) |
申请公布日期 |
2009.12.09 |
申请号 |
EP20060718824 |
申请日期 |
2006.01.19 |
申请人 |
GRAFTECH INTERNATIONAL HOLDINGS INC. |
发明人 |
NORLEY, JULIAN;GETZ, MATTHEW GEORGE;REIS, BRADLEY E.;TZENG, JING-WEN |
分类号 |
B23B5/16;B32B9/00;B32B37/12;C01B31/00;C04B35/52;C04B35/536;H01L23/373;H01M4/66;H05K1/05 |
主分类号 |
B23B5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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