| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable electronic device by decreasing exfoliation between a circuit board and a resin material, and occurrence of chipping of the circuit board. <P>SOLUTION: The electronic device 10 comprises an electronic component element 2 mounted on an upper surface of a rectangular circuit board 1, and a resin material 3 covering the device. A notch 1a with its lower end disengaged from the lower surface of the board 1 and with its upper end opened to the upper surface of the board 1 is formed at four corners of the board 1. A part of the resin material 3 is filled in a region in which the notch 1a is formed, and the filled resin material 3 is adhered to the side of the board 1 which faces to the notch 1a. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
