METAL PASTE FOR SEALING, METHOD FOR HERMETICAL SEALING OF PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE

摘要

The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 µm to 1.0 µm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300°C to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.