发明名称 SUBSTRATE PROCESSING SYSTEM
摘要 Leakage of an atmosphere of a solvent vapor used by a smoothing process for smoothing the surface of a resist pattern outside from a smoothing unit is prevented to facilitate incorporating the smoothing unit into a coating and developing system. A substrate processing system has a coating and developing block 20, a smoothing block 50, an airflow producing unit 60 for producing down airflow that flows down from above the coating and developing block 20 and the smoothing block 50, and a main controller 100 for controlling the airflow producing unit 60. The main controller 100 controls a flow regulating valve 64a placed in an air passage 63a connecting the airflow producing unit 60 to the coating and developing block 20 and a flow regulating valve 64b placed in an air passage 63b connecting the airflow producing unit 60 to the smoothing block 50 on the basis of a signal provided by a pressure sensor 65a for measuring the pressure in the coating and developing block 20 and a signal provided by a pressure sensor 65b for measuring the pressure in the smoothing block 50 such that the pressure in the smoothing block 50 is lower than that in the coating and developing block 20.
申请公布号 US2009151631(A1) 申请公布日期 2009.06.18
申请号 US20080336711 申请日期 2008.12.17
申请人 TOKYO ELECTRON LIMITED 发明人 MINAMIDA JUNYA;ISHIDA SEIKI
分类号 B05C11/00 主分类号 B05C11/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利