FLAME-RESISTANT PHOTO-SENSITIVE RESIN COMPOSITION, AND CIRCUIT BOARD COMPRISING THE SAME

摘要

Disclosed is a photo-sensitive resin composition which can be cured into a material having flexibility. Also disclosed is a flame-resistant insulating coating film which has excellent storage stability at room temperature, and which can be cured or processed without the need of employing any high-temperature treatment. Specifically disclosed is a flame-resistant photo-sensitive resin composition essentially comprising: (A) a siloxane-containing polyamic acid resin having an ethylenically unsaturated bond; (B) a metal salt of an organic phosphinic acid; (C) at least one ester compound which has a solid form at ambient temperature and which is selected from an aromatic phosphoric acid condensate ester, a phthalic acid ester and an aliphatic ester; and (D) a photo-polymerization initiator, wherein the component (A) is a siloxane-containing polyamic acid resin produced by reacting an acid anhydride component comprising an aromatic tetracarboxylic acid dianhydride and a diamine component comprising a siloxane diamine and an aromatic diamine having an ethylenically unsaturated bond, and wherein the components (B) and (C) are contained in amounts of 20 to 35 parts by weight and 5 to 20 parts by weight, respectively, relative to 100 parts by weight of the component (A).