| 摘要 |
A wet station apparatus, a wet cleaning method, and a controller of a wet cleaning apparatus are provided to reduce a cleaning time and a cleaning cost by selectively performing a cleaning process and a dry process using deionized water. A chemical is received in first to third chemical baths(1,3,5). A wet etching process of a wafer is performed in the first to third chemical baths. First to third deionized baths(2,4,6) use the deionized water for cleaning the wafer. A deionized water overflow bath(7) overflows the deionized water. A drier(8) dries the wafer after the overflow process. First to fifth chucks(10,20,30,40,50) moves the wafer between the first to third chemical baths, the first to third deionized water baths, the deionized water overflow bath, and the drier. A controller(100) of a wet clean apparatus controls the cleaning process of the chuck.
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