| 摘要 |
PROBLEM TO BE SOLVED: To improve piping for thermostatic equipment used for a testing device called a wafer prober and used to test the performance of a semiconductor wafer and so on, the piping for thermostatic equipment being developed which dissipates less heat and is easily moved in the device. SOLUTION: The piping 20 for thermostatic equipment includes a wire (long-sized flexible member) 25 in the center and has going-side piping 21 and return-side piping 22 fixed in parallel on both sides of the wire 25 through a piping holding member 26. The external diameter (d) of the going-side piping 21 is smaller than the external diameter D of the return-side piping 22. Neither the going-side piping 21 nor the return-side piping 22 includes a heat insulator. COPYRIGHT: (C)2009,JPO&INPIT
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