| 摘要 |
<p>On each side of a bonding pad (101) which surrounds a bonding opening (108), a slit-shaped space area (107) is provided and is separated into an area (101a) on the side of the bonding opening (108) of the bonding pad (101) and an area (101b) on the side of a wiring layer (102) adjacent to the area (101a), having a space area (107a) as a boundary. Since the area (101b) is separated from the area (101a) by a width of the space area (107a) and has a part of a passivation film (103), which is a soft material compared with a metal material, buried therein, heat stress is absorbed and diffused by the space area (107a) and diffusion of metal atoms from the area (101a) to the area (101b) is remarkably suppressed.</p> |
