| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounted structural body for raising reliability in connection between a wiring board and an electronic component by reliably filling a resin up to the outer circumference of the electronic component, and to provide a method of manufacturing the mounted structural body. <P>SOLUTION: Including a wiring board 1 having an electronic component 4 mounted at least on a first surface 1A, a resin 3 applied at least between the electronic component 4 and the wiring board 1, and a through-hole 2 provided in a region corresponding to the mounting position of the electronic component 4 in the wiring board 1, a protrusion 20 is formed on the wiring board 1 so as to overlap at least with the electronic component 4, around a region corresponding to the mounting position of the electronic component 4. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
