| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC card that has a high physical strength characteristic, protects an IC chip from breakage, and has high planeness/smoothness of the card surface and high reliability, and to provide an IC inlet used for it. <P>SOLUTION: A silicon wafer having an IC circuit and a connecting terminal formed thereon is ground, a reinforcing plate thicker than the silicon wafer is stuck to the back surface of the ground silicon wafer using an adhesive, the silicon wafer to which the reinforcing plate is stuck is diced to manufacture a thinned IC chip, and an antenna sheet is stuck to the thinned IC chip via a resin composition. <P>COPYRIGHT: (C)2009,JPO&INPIT |
