发明名称 COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a component mounting device capable of improving maintenance workability of application heads while having a compact structure having the application heads and a mounting head arranged on the same head movement guide arranged by horizontally extending. <P>SOLUTION: On the head movement guide 25 arranged by horizontally extending in a Y-axis direction in which a component supply stage 3 and a board holding stage 4 are arranged, this component mounting device 1 is provided with: the application heads 43 applying an adhesive to a board 14 held to a board holding stage 4; and the mounting head 33 arranged in a region on the component supply stage 3 side relative to the application heads 43 on the head movement guide 25 for mounting a component 7 on the board 14. An end of the head movement guide 25 on the component supply stage 3 side extends to the side opposite to the board holding stage 4 beyond the upper position of the component supply stage 3. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009135366(A) 申请公布日期 2009.06.18
申请号 JP20070312095 申请日期 2007.12.03
申请人 PANASONIC CORP 发明人 NODA KAZUHIKO
分类号 H05K13/04;H01L21/52 主分类号 H05K13/04
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