发明名称 MULTIPIECE SUBSTRATE, PACKAGE AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To efficiently reflect light of a light emitting element to radiate the reflected light outward well, and strongly join respective members such as the light emitting element and a bonding wire. <P>SOLUTION: A multipiece substrate includes a plurality of light emitting element housing parts 4, and each of the plurality of light emitting element housing parts 4 includes a gold-plated layer 9 electrically connected to the light emitting element 3, and a silver-plated layer 10 surrounding the light emitting element 3. First conductors 11 for the gold-plated layer and second conductors 12 for the silver-plated layer are arranged on insulation layers different from each other. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009135535(A) 申请公布日期 2009.06.18
申请号 JP20090062963 申请日期 2009.03.16
申请人 KYOCERA CORP 发明人 KUWATA YOSHIMICHI;FURUMOTO YUICHI;TAMARU HIDEKAZU
分类号 H01L33/48;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/48
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